Vapor chamber device

ABSTRACT

A vapor chamber device adapted to be thermally coupled to a heat source includes a first casing and a second casing. The first casing includes a first plate, a first capillary structure at an inner surface of the first plate, and a first lateral wall protruding from the inner surface and surrounding the first capillary structure. The heat source is adapted to contact an outer surface of the first plate. The second casing is stacked on the first casing and includes a second plate, a plurality of supporting posts protruding from the second plate, and a second lateral wall protruding from the second plate and surrounding the supporting posts. The supporting posts face towards the first capillary structure, and the first lateral wall is connected to the second lateral wall. The vapor chamber device includes a second capillary structure disposed between the first capillary structure and the supporting posts, and a third capillary structure disposed in an area which is at the inner surface of the first plate and corresponds to the heat source.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of and claims the prioritybenefit of U.S. application Ser. No. 16/782,020, filed on Feb. 4, 2020,which claims the priority benefit of Taiwan application serial no.108145459, filed on Dec. 12, 2019. The entirety of each of theabove-mentioned patent applications is hereby incorporated by referenceherein and made a part of this specification.

BACKGROUND Technical Field

The disclosure relates to a vapor chamber device, and in particular, toa high-efficacy vapor chamber device.

Description of Related Art

A vapor chamber is a common heat sink. The vapor chamber mainly includesa flat sealed casing, a capillary tissue formed in the flat sealedcasing, and working fluid filling the flat sealed casing. The flatsealed casing contacts a heat source, e.g., a central processing unit(CPU), and dissipates heat for the heat source through a vapor-liquidphase change of the working fluid in the vapor chamber. How to improveheat dissipation capacity of the vapor chamber is to be researched inthe field.

SUMMARY

The disclosure provides a vapor chamber device having a favorable heatdissipation effect.

A vapor chamber device provided in one embodiment of the disclosureincludes working fluid and is adapted to be thermally coupled to a heatsource. The vapor chamber device includes a first casing and a secondcasing. The first casing includes a first plate, a first capillarystructure at an inner surface of the first plate, and a first lateralwall protruding from the inner surface and surrounding the firstcapillary structure, where the heat source is adapted to be in contactwith an outer surface of the first plate. The second casing is stackedon the first casing and includes a second plate, a plurality ofsupporting posts protruding from the second plate, and a second lateralwall protruding from the second plate and surrounding the supportingposts, where a plurality of vapor channels are formed between thesupporting posts. The supporting posts face towards the first capillarystructure, and the first lateral wall is connected to the second lateralwall. The vapor chamber device further includes a second capillarystructure and a third capillary structure. The second capillarystructure is disposed between the first capillary structure and thesupporting posts of the second casing. The third capillary structure isdisposed in an area which is at the inner surface of the first plate andcorresponds to the heat source.

In an embodiment of the disclosure, the first capillary structureincludes a plurality of trenches formed between a plurality ofprotruding bars, and an area which is in the trenches and corresponds tothe heat source is filled with the third capillary structure.

In an embodiment of the disclosure, the second capillary structure is amesh structure woven by a plurality of wires and includes a plurality ofholes, and the holes corresponding to the heat source and the trenchesof the first capillary structure are filled with the third capillarystructure.

In an embodiment of the disclosure, the second capillary structure hasan opening corresponding to the heat source, and the opening and thetrenches of first capillary structure are filled with the thirdcapillary structure.

In an embodiment of the disclosure, the first plate has a cavitycorresponding to the heat source, the first capillary structure islocated outside the cavity, and the cavity is filled with the thirdcapillary structure.

In an embodiment of the disclosure, the second capillary structure is amesh structure woven by a plurality of wires and includes a plurality ofholes, and the holes corresponding to the heat source are filled withthe third capillary structure.

In an embodiment of the disclosure, the second capillary structure hasan opening corresponding to the heat source, and the opening is filledwith the third capillary structure.

In an embodiment of the disclosure, the supporting posts are evenlydistributed on the second plate, and a cross-shaped vapor flow channelis formed between the supporting posts.

In an embodiment of the disclosure, the supporting posts include aplurality of first supporting posts and a plurality of second supportingposts, a shape of the first supporting post is different from the shapeof the second supporting post, the first supporting posts are disposedcorresponding to the heat source, and the second supporting posts arelocated beside the first supporting posts and extend along an axialdirection. A cross-shaped vapor flow channel is formed between thesupporting posts.

In an embodiment of the disclosure, one portion of the supporting postsis disposed corresponding to the heat source, the other portion of thesupporting posts is radially arranged around the one portion of thesupporting posts as a center, and a cross-shaped vapor flow channel isformed between the supporting posts.

In an embodiment of the disclosure, the supporting posts include aplurality of rectangular posts, a plurality of conical posts, aplurality of trapezoidal posts, a plurality of cylinders, or a pluralityof irregular posts.

In an embodiment of the disclosure, the first capillary structureincludes a plurality of trenches, and at least some of the trenches areradially arranged.

In an embodiment of the disclosure, the third capillary structureincludes metal powders or non-woven metal wool.

Based on the above, for the vapor chamber device of the disclosure, inaddition to the first capillary structure and the second capillarystructure disposed between the first casing and the second casing toimprove heat dissipation efficiency, the third capillary structure isfurther disposed in an area which is at the inner surface of the firstplate and corresponds to the heat source. With the third capillarystructure, the liquid disposed in the vapor chamber device may besubject to a greater capillary force, the trenches that are in the firstcapillary structure and that are covered by the second capillarystructure have lower flow resistance, and the liquid may be more quicklysupplemented to the area corresponding to the heat source, so as toimprove the anti-drying capability of the area. Therefore, a sufficientamount of liquid may be maintained in the area for phase changes, andthe drying tendency in the area may be reduced. Thereby, the vaporchamber device provided in one or more embodiments of the disclosure mayhave a better heat dissipation effect.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic diagram of an appearance of a vapor chamberdevice according to an embodiment of the disclosure.

FIG. 1B is a schematic cross-sectional view of the vapor chamber devicetaken along line A-A of FIG. 1A.

FIG. 1C is a schematic cross-sectional view of the vapor chamber devicetaken along line B-B of FIG. 1A.

FIG. 1D is a schematic diagram of an inner surface of a second casing ofthe vapor chamber device of FIG. 1A.

FIG. 1E is a schematic cross-sectional view of a vapor chamber deviceaccording to another embodiment of the disclosure.

FIG. 2A and FIG. 2B are schematic diagrams of a second casing of aplurality of vapor chamber devices according to other embodiments of thedisclosure.

FIG. 2C is a schematic diagram of an inner surface of a first casing ofa vapor chamber device according to other embodiments of the disclosure.

FIG. 3 is a schematic diagram of a vapor chamber device according toanother embodiment of the disclosure.

FIG. 4 is a schematic diagram of a vapor chamber device according toanother embodiment of the disclosure.

FIG. 5 is a schematic diagram of a vapor chamber device according toanother embodiment of the disclosure.

DESCRIPTION OF THE EMBODIMENTS

FIG. 1A is a schematic diagram of an appearance of a vapor chamberdevice according to an embodiment of the disclosure. However, the shapeof the appearance is not limited to a square plate shape and may be anyshape. FIG. 1B is a schematic cross-sectional view of the vapor chamberdevice taken along line A-A of FIG. 1A. FIG. 1C is a schematiccross-sectional view of the vapor chamber device taken along line B-B ofFIG. 1A.

With reference to FIG. 1A to FIG. 1C, a vapor chamber device 100 of thepresent embodiment is adapted to be thermally coupled to a heat source10 (FIG. 1B). The heat source 10 is, for example, a central processingunit of a main board, but the heat source 10 may also be other chips,and the type and quantity of heat sources 10 are not limited thereto.The vapor chamber device 100 includes a first casing 110 and a secondcasing 120. As shown in FIG. 1B, the first casing 110 includes a firstplate 111, a first capillary structure 113 at an inner surface 1112 ofthe first plate 111, and a first lateral wall 117 protruding from theinner surface 1112 and surrounding the first capillary structure 113.The heat source 10 is adapted to be in contact with an outer surface1114 of the first casing of the first plate 111, and heat energygenerated by the heat source 10 is transferred to the vapor chamberdevice 100.

As shown in FIG. 1B and FIG. 1C, the first capillary structure 113includes a plurality of trenches 114 formed between a plurality ofprotruding bars 112. More specifically, the protruding bars 112 protrudefrom the inner surface 1112 of the first plate, so that trenches 114 aredefined between two adjacent protruding bars 112. The design of thefirst capillary structure 113 using the trenches 114 may provide asmaller flow resistance. In the present embodiment, a width of thetrench 114 is, for example, between 50 μm and 200 μm, and a depth of thetrench 114 is, for example, between 50 μm and 200 μm, but the width andthe depth of the trench 114 are not limited thereto. However, capillaryforce of a simple open trench is insufficient, and the simple opentrench is not suitable for a non-horizontal vapor chamber device workingagainst gravity. However, if a second capillary structure 130 is coveredwith a layer of mesh, it may not only maintain the advantage of low flowresistance of the trench, but also significantly improve capillaryforce, so that the vapor chamber device is adapted to be placed againstgravity. If non-woven metal wool or metal powders with strongercapillary force are further added to the capillary structure near theheat source 10, the capillary force there may further be enhanced, andthe anti-drying capability may be improved.

Therefore, as shown in FIG. 1B, the vapor chamber device 100 furtherincludes a second capillary structure 130 and a third capillarystructure 140 disposed near the corresponding heat source 10. The secondcapillary structure 130 is disposed between the first capillarystructure 113 and supporting posts 122, to cover the first capillarystructure 113 and strengthen the capillary and channel functions of thefirst capillary structure 113. The third capillary structure 140 is onlydisposed in the capillary structure near a position corresponding to theheat source 10, and does not block a path through which liquid passeswhen flowing back.

In addition, in the present embodiment, the first plate 111 and theprotruding bars 112 are integrally formed, and such a design may have arelatively simple structure. Since there is no thermal contactresistance between the first plate 111 and the protruding bars 112 (thatis, between the first plate 111 and the trenches 114), the heat transfereffect is better.

The second casing 120 is stacked on the first casing 110 and includes asecond plate 121, a plurality of supporting posts 122 protruding fromthe second plate 121, and a second lateral wall 128 protruding from thesecond plate 121 and surrounding the supporting posts 122. In thepresent embodiment, the supporting posts 122 are flush with the secondlateral wall 128, but a relationship between the supporting posts 122and the second lateral wall 128 is not limited thereto.

FIG. 1D is a schematic diagram of an inner surface of a second casing ofthe vapor chamber device of FIG. 1A. With reference to FIG. 1D, in thepresent embodiment, shapes of the supporting posts 122 are uniformly andevenly distributed on the inner surface of the second plate 121, and aplurality of vapor channels 124 is formed between the supporting posts122.

The supporting posts 122 are, for example, square posts, but in otherembodiments, the supporting posts 122 may also be rectangular posts,cylinders, elliptical posts, polygonal posts, tapered posts, irregularposts, or/and a combination thereof. Shapes and forms of distribution ofthe supporting posts 122 are not limited thereto. The supporting posts122 are integrally formed with the second plate 121, but mayalternatively be joined through other manners such as welding anddepositing.

FIG. 1E is a schematic cross-sectional view of a vapor chamber deviceaccording to another embodiment of the disclosure. Cross-sectionalshapes of supporting posts 122′ of a vapor chamber device 100′ areinverted trapezoids, and therefore a cross-sectional shape of aconstructed vapor channel 124′ is trapezoidal. In other embodiments, thesupporting posts 122′ include a plurality of rectangular posts, aplurality of conical posts, a plurality of trapezoidal posts, aplurality of cylinders, or a plurality of irregular posts. Therefore,the cross-sectional shapes of the supporting posts 122′ may betriangles, arcs, or other shapes. Similarly, the cross-sectional shapeof the vapor channel 124′ may be a triangle, an arc, or other shapes.

Returning to FIG. 1B, in the present embodiment, the supporting posts122 face the first capillary structure 113. In addition, in the presentembodiment, the first casing 110 and the second casing 120 are, forexample, two metal casings, and the first lateral wall 117 is engagedwith the second lateral wall 128 to provide favorable structuralstrength. A manner in which the first lateral wall 117 and the secondlateral wall 128 is, for example, diffusion bonding or brazing, whichshould however not be construed as a limitation in the disclosure.

In the present embodiment, the first capillary structure 113 is slightlylower than the first lateral wall 117, and when the second capillarystructure 130 is approximately flush with the first lateral wall 117when being disposed on the first capillary structure 113, so that whenthe first lateral wall 117 is engaged with the second lateral wall 128,the supporting posts 122 may abut against the second capillary structure130. Definitely, in other embodiments, the foregoing height relationshipis not limited thereto.

It should be noted that, in the present embodiment, an appropriateamount of working fluid g such as water fills inner space surrounded bythe first casing 110 and the second casing 120, but the type of theworking fluid g is not limited thereto. For example, the working fluid gflows in the trench 114 of the first capillary structure 113 of thefirst casing 110 in a form of liquid. The working fluid g absorbs heatin an area close to the heat source 10 and evaporates into vapor.

Therefore, in the present embodiment, the supporting posts 122 abutagainst the second capillary structure 130, and may support the secondplate 121, which may effectively prevent the first casing 110, thesecond casing 120, and the vapor channel 124 from being collapsed duringevacuating. In addition, when the working fluid g is condensed intoliquid from vapor, the working fluid g may also flow down along alateral wall of the supporting post 122. In other words, the supportingposts 122 may also serve as a structure for guiding the working fluid g(liquid) to flow down.

In the present embodiment, the second capillary structure 130 is a meshstructure woven by a plurality of wires 132, such as a copper mesh.Definitely, in other embodiments, the second capillary structure 130 mayalso be a non-woven mesh or a porous metal foam capillary structure, andthe form of the second capillary structure 130 is not limited thereto.

It is worth mentioning that in FIG. 1B, since the second capillarystructure 130 is disposed on the trenches 114 of the first capillarystructure 113, tops of the trenches 114 of the first capillary structure113 are covered by the second capillary structure 130. However, asimilar capillary structure is formed in a direction (a direction ofemitting or injecting into the drawing surface) in which the trenches114 extend, and the structure may enable the working fluid g in thetrenches 114 to resist gravity and allow the vapor chamber device 100 tocomplete thermal cycle well under a non-horizontal condition.

In addition, in the present embodiment, the third capillary structure140 is disposed in an area that is at the inner surface 1112 of thefirst plate 111 and that corresponds to the heat source 10. Inparticular, in the present embodiment, since the trenches 114 of thefirst capillary structure 113 are evenly distributed on the first plate111, some (especially a central trench) of the trenches 114 correspondto the area that is on the first plate 111 and that corresponds to theheat source 10. Therefore, in the present embodiment, an area that is inthe trenches 114 and corresponds to the heat source 10 is filled withthe third capillary structure 140.

As shown in FIG. 1C, the second capillary structure 130 includes aplurality of holes 134. It should be noted that, in a cross section ofFIG. 1B, wires 132 of the second capillary structure 130 are just cut,and the holes 134 cannot be seen. In a cross section of FIG. 1C, arelationship between the wires 132 of the second capillary structure 130and the holes 134 may be observed. In addition, the cross section ofFIG. 1C is just cut along one of the trenches 114 of the first capillarystructure 113, and the protruding bars 112 cannot be seen in thissection. The supporting posts 122 of the second casing 120 are not cutin FIG. 1C, and only the vapor channel 124 is shown.

The holes 134 corresponding to the heat source 10 are filled with thethird capillary structure 140. In the present embodiment, a sinteredcapillary structure is taken as an example of the third capillarystructure 140. For example, metal powders are sintered in a local areaof the trenches 114 and the holes 134. Definitely, in other embodiments,the form of the third capillary structure 140 is not limited thereto. Inaddition, in an embodiment that is not illustrated, the second capillarystructure 130 may also be a metal foam layer with a large number ofholes inside, and the holes of the metal foam layer and the trenches 114of the first capillary structure 113 are filled with the third capillarystructure 140 (metal powders).

As shown in FIG. 1C, the outer surface 1114 (marked in FIG. 1B) of thefirst casing 110 of the vapor chamber device 100 is in contact with theheat source 10, heat generated by the heat source 10 is transferred tothe first casing 110. An area that is of the vapor chamber device 100and that corresponds to the heat source 10 is referred to as anevaporation area. In the evaporation area, the liquid in the trenches114 absorbs heat and vaporizes into vapor. The working fluid g (vapor)flows upward to the vapor channel 124 of the second casing 120 anddiffuse into an internal vapor cavity of the second casing 120, furthercondenses into a liquid in the condensing area (for example, the outersurface 129 of the second casing of the vapor chamber plate, or aselected area of the outer surface 1114 of the first casing that is notin contact with the heat source 10) of the vapor chamber plate, and theheat is discharged from the vapor chamber device 100. The condensedworking fluid g (liquid) flows down to the trench 114 of the firstcasing 110 and flows through the trench 114 to the third capillarystructure 140 to complete a cycle.

It is worth mentioning that, in the present embodiment, the trenches 114of the first capillary structure 113 and the holes 134 of the secondcapillary structure 130 in the evaporation area are filled with thethird capillary structure 140. Since the third capillary structure 140provides strong capillary force, the working fluid g may be easilysucked into the evaporation area, to avoid a case that the vaporizedliquid in the evaporation area cannot be supplemented in time, therebyproviding good anti-drying capability. In addition, the trenches 114 ofthe first capillary structure 113 and the holes 134 of the secondcapillary structure 130 are not provided with a third capillarystructure 140 outside an area corresponding to the heat source 10, sothat a low flow resistance may be maintained.

In this way, the foregoing design of the vapor chamber device 100 maygreatly increase the maximum heat dissipation amount without increasingthe thickness (the thickness of the first capillary structure 113 andthe second capillary structure 130 may be maintained), and may beapplied to a thin device. Through testing, in comparison with the vaporchamber without the third capillary structure 140, the maximum heatdissipation amount of the vapor chamber device 100 of the presentembodiment may be increased by at least 50%, so that the vapor chamberdevice has improved performance.

The working fluid evaporates in the capillary structure close to theheat source, and the formed vapor passes through the cross-shaped vaporflow channel formed between the plurality of supporting posts of thesecond plate, diffuses to the vapor cavity inside the entire vaporchamber, and further condenses into a liquid in the condensing area ofthe vapor chamber, and the heat is discharged from the vapor chamberdevice. The condensed liquid passes through the capillary structurebelow, flows back to the area near the heat source, and evaporates, tocomplete a thermal cycle. Since the third capillary structurecorresponding to the heat source area has stronger capillary force, andthe trenches that are in the first capillary structure and that arecovered by the second capillary structure have both lower flowresistance and stronger capillary force, the three capillary structuresare properly matched, so that the working fluid may flow back to theevaporation area near the heat source more quickly, and the evaporationarea of the vapor chamber device is less easier to dry out and has morefavorable heat dissipation efficiency.

A vapor chamber device in another pattern or a second casing thereof isdescribed below. Same or similar elements as the previous embodiment aredenoted by same or similar symbols. The descriptions thereof are omittedherein, and only main differences are described.

FIG. 2A and FIG. 2B are schematic diagrams of a second casing of aplurality of vapor chamber devices according to other embodiments of thedisclosure. With reference to FIG. 2A first, a main difference betweenthe second casing 120 a of FIG. 2A and the second casing 120 of FIG. 1Dis that, in the present embodiment, these supporting posts include aplurality of first supporting posts 122 a and a plurality of secondsupporting posts 123, and a shape of the first supporting post 122 a isdifferent from a shape of the second supporting post 123. The firstsupporting posts 122 a are disposed corresponding to the heat source 10,and the second supporting posts 123 are located beside the firstsupporting posts 122 a and extend along an axial direction A1.

In the present embodiment, the second casing 120 a is provided withdensely populated first supporting posts 122 a corresponding to the heatsource 10, so as to provide good structural strength. The secondsupporting posts 123 are disposed on both sides of the first supportingposts 122 a and extend along the axial direction A1 to guide a flowdirection of the working fluid g (vapor).

With reference to FIG. 2B, a main difference between the second casing120b of FIG. 2B and the second casing 120 a of FIG. 2A is that, in thepresent embodiment, one portion (the first supporting posts 122 a) ofthese supporting posts is disposed corresponding to the heat source 10,and the other portion of the supporting posts (the second supportingposts 123, 125, and 127) is radially arranged around the firstsupporting posts 122 a as a center. Such a design may also well guidethe flow direction of the working fluid g (vapor).

FIG. 2C is a schematic diagram of an inner surface of a first casing ofa vapor chamber device according to other embodiments of the disclosure.With reference to FIG. 2C, in the present embodiment, the first casing110″ has trenches 114, 112″, 115, 118, and 119 with a plurality ofdifferent directions, and the trenches are radial to reduce the flowresistance and allow the condensed liquid to flow back quickly. Thearrangement pattern of the trenches on the inner surface of the firstcasing is not limited to a radial pattern, and any arrangement patternsufficient to guide the working fluid g (liquid) may be applicable.

FIG. 3 is a schematic diagram of a vapor chamber device according toanother embodiment of the disclosure. With reference to FIG. 3 , a maindifference between a vapor chamber device 100 c of FIG. 3 and the vaporchamber device 100 of FIG. 1B is that, in the present embodiment, asecond capillary structure 130 c has an opening 136 corresponding to aheat source 10, and the entire opening 136 is filled with a thirdcapillary structure 140. In other words, in the present embodiment, thecapillary structure that is in the evaporation area and that correspondsto the heat source 10 is mainly composed of the trenches 114 and thethird capillary structure 140.

FIG. 4 is a schematic diagram of a vapor chamber device according toanother embodiment of the disclosure. With reference to FIG. 4 , a maindifference between a vapor chamber device 100d of FIG. 4 and the vaporchamber device 100 of FIG. 1B is that, in the present embodiment, afirst casing 110 has a cavity 116 corresponding to a heat source 10, anda first capillary structure 113 is located outside the cavity 116. Thecavity 116 and the holes 134 (marked in FIG. 1C) corresponding to theheat source 10 are filled with the third capillary structure 140. Inother words, in the present embodiment, the capillary structure that isin the evaporation area and that corresponds to the heat source 10 ismainly composed of the second capillary structure 130 and the thirdcapillary structure 140.

FIG. 5 is a schematic diagram of a vapor chamber device according toanother embodiment of the disclosure. With reference to FIG. 5 , a maindifference between the vapor chamber device 100 e of FIG. 5 and thevapor chamber device 100 d of FIG. 4 is that, in the present embodiment,a second capillary structure 130 c has an opening 136 corresponding to aheat source 10, and the entire opening 136 is filled with a thirdcapillary structure 140. In other words, in the present embodiment, thecapillary structure that is in the evaporation area and that correspondsto the heat source 10 is mainly composed of the third capillarystructure 140.

A contact surface of the first capillary structure and the secondcapillary structure may be sintered or bonded by thermocompression, andthe third capillary structure between the first capillary structure andthe second capillary structure may also be sintered to enhance thestructural strength and heat-conducting performance.

Based on the above, for the vapor chamber device of the disclosure, inaddition to the first capillary structure and the second capillarystructure disposed between the first casing and the second casing toimprove heat dissipation efficiency, the third capillary structure isfurther disposed in an area that is at the inner surface of the firstplate and that corresponds to the heat source. With the third capillarystructure, the liquid disposed in the vapor chamber device may besubject to greater capillary force and supplemented to the area morequickly, to improve the anti-drying capability of the area. Therefore, asufficient amount of liquids may be maintained in the area for phasechanges, and a probability that the vaporized liquid in the area cannotbe supplemented to the area in time to cause excessive temperature riseof the heat source may be reduced. In this way, the vapor chamber deviceof the disclosure may exhibit better heat dissipation efficiency.

What is claimed is:
 1. A vapor chamber device adapted to be thermallycoupled to a heat source, the vapor chamber device comprising: a firstcasing comprising a first plate, a first capillary structure at an innersurface of the first plate, and a first lateral wall protruding from theinner surface and surrounding the first capillary structure, wherein theheat source is adapted to be in contact with an outer surface of thefirst plate, and the first capillary structure serves as a liquidchannel; a second casing stacked on the first casing and comprising asecond plate, a plurality of supporting posts protruding from the secondplate, and a second lateral wall protruding from the second plate andsurrounding the supporting posts, wherein a plurality of vapor channelsare formed between the supporting posts, the supporting posts facetowards the first capillary structure, and the first lateral wall isconnected to the second lateral wall; a second capillary structuredisposed between the first capillary structure and the supporting postsof the second casing, wherein the supporting posts abut against thesecond capillary structure; and a third capillary structure disposed atthe inner surface of the first plate and corresponding to the heatsource, wherein the first plate is entirely integrally formed, the firstcapillary structure comprises a plurality of trenches formed between aplurality of protruding bars, a first area which is in the trenches andcorresponds to the heat source is filled with the third capillarystructure, a second area which is in the trenches and does notcorrespond to the heat source is not filled with the third capillarystructure, and the third capillary structure comprises metal powders ornon-woven metal wool.
 2. The vapor chamber device according to claim 1,wherein the supporting posts are evenly distributed on the second plate.3. The vapor chamber device according to claim 1, wherein one portion ofthe supporting posts is disposed corresponding to the heat source, andthe other portion of the supporting posts is radially arranged aroundthe one portion of the supporting posts as a center.
 4. The vaporchamber device according to claim 1, wherein the supporting postscomprise a plurality of rectangular posts, or a plurality of cylinders.5. The vapor chamber device according to claim 1, wherein the supportingposts comprise a plurality of conical posts, a plurality of trapezoidalposts, or a plurality of irregular posts.
 6. The vapor chamber deviceaccording to claim 1, wherein at least one portion of the trenches isradially arranged.
 7. The vapor chamber device according to claim 1,wherein a top surface of the second capillary structure and a topsurface of the first lateral wall are located at a same plane.